- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 13/424 - Securing in a demountable manner in base or case composed of a plurality of insulating parts having at least one resilient insulating part
Patent holdings for IPC class H01R 13/424
Total number of patents in this class: 275
10-year publication summary
13
|
11
|
17
|
26
|
30
|
41
|
35
|
26
|
11
|
13
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Yazaki Corporation | 6282 |
25 |
Sumitomo Wiring Systems, Ltd. | 9367 |
23 |
Aptiv Technologies AG | 2097 |
16 |
Sumitomo Electric Industries, Ltd. | 14131 |
13 |
AutoNetworks Technologies, Ltd. | 5809 |
11 |
TE Connectivity Solutions GmbH | 2580 |
11 |
Lear Corporation | 1196 |
9 |
Advanced Connectek Inc. | 338 |
8 |
TE Connectivity Germany GmbH | 655 |
7 |
Tyco Electronics (shanghai) Co. Ltd. | 759 |
6 |
HARTING Electric GmbH & Co. KG | 437 |
6 |
J.S.T. Corporation | 187 |
5 |
Foxconn Interconnect Technology Limited | 1034 |
4 |
Hirschmann Automotive GmbH | 321 |
4 |
Japan Aviation Electronics Industry, Limited | 1585 |
4 |
Lotes Co., Ltd. | 346 |
4 |
Foxconn (Kunshan) Computer Connector Co., Ltd. | 286 |
4 |
Hubbell Incorporated | 3052 |
3 |
BAE SYSTEMS plc | 2215 |
3 |
Carlisle Interconnect Technologies, Inc. | 139 |
3 |
Other owners | 106 |